Highest Reliability SMT Process
Qualitel’s SMT process yields the highest reliability in the marketplace using state-of-the-art redundant equipment like Panasonic Pick & Place and Myrcronic production solutions. All of our lines have identical configurations for perfectly repeatable products, whether we’re manufacturing NPI assemblies or quick-turn and prototyping.
- 2012 - EKRA X5 Pro Screen Printer
- 2019 - KOH YOUNGKY8030-3, 3D Solder Paste Inspection System
- 2020 - Panasonic NPM-W2 Pick and Place (Qty 4)
- 2017 - Heller 1812 MKIII SMT 15-Zone Reflow Oven
- 2019 - Kohyoung Zenith Lite 3D Inspection machine (AOI)
- 2012 - EKRA X5 Pro Screen Printer
- 2019 - KOH YOUNGKY8030-3, 3D Solder Paste Inspection System
- 2020 - Panasonic NPM-W2 Pick and Place (Qty 3)
- 2017 - Heller 1812 MKIII SMT 15-Zone Reflow Oven
- 2019 - Kohyoung Zenith Lite 3D Inspection machine (AOI)
- 2012 - EKRA X5 Pro Screen Printer
- 2015 - T.R.I Solder Paste Inspection System - Model TR7007LL SII
- 2020 - Mycronic MY200DX SMT Pick & Place (Qty 2)
- 2017 - Heller 1812 MKIII SMT 15-Zone Reflow Oven
- 2019 - Kohyoung Zenith Lite 3D Inspection machine (AOI)
- 2020 - Mycronic My700 Solder Paste Jet Printing
- 2020 - Mycronic My300DX-17 SMT Pick & Place
- 2017 - Heller 1812 MKIII SMT 15-Zone Reflow Oven
- 2012 - EKRA X5 Pro Screen Printer
- 2015 - Mycronic My600 Solder Paste Jet Printing
- 2015 - Mycronic MY100DXe SMT Pick & Place
- 2015 - Mycronic MY100LXe SMT Pick & Place
- 2017 - Heller 1812 MKIII SMT 15-Zone Reflow Oven
Flexible SMT Capabilities
Qualitel has multiple SMT lines for production and NPI assemblies and dedicated lines for our Express Quick-Turn prototyping. Our state-of-the-art production lines provide the following capabilities:
Micro Ball Grid Arrays (BGA)
Fine Pitch Technology and 0201 Metric
Board warpage detection for accurate placement